A leading innovator and developer of wireless technologies, Qualcomm Incorporated, today launched an expanded product road map for its Gobi connectivity technologies as part of the Organization’s expanded focus on targeting new markets with Gobi connectivity.
The new modem chipsets that have been added to the Gobi product family deliver support for CDMA2000® 1xEV-DO Rev. A and Rev. B, HSPA+, dual-carrier HSPA+ and LTE with integrated backwards compatibility to EV-DO and HSPA.
As an embedded module, building on the success of Gobi technology in PC markets, Qualcomm is now prepared to serve the requirements of additional market segments, including e-readers, USB modems, gaming devices and M2M commercial applications.
Qualcomm’s Gobi solutions include software enhancements for select MDM chipsets that will enable a common Gobi software interface (API) across multiple hardware platforms. This interface will help streamline integration efforts, spur application development among third-party developers and deliver greater flexibility to device manufacturers.
The following data chipsets are now available with the Gobi API:
MDM6200™ – supports HSPA+ data rates of up to 14.4 Mbps
MDM8200A™ – supports HSPA+ data rates of up to 28 Mbps
MDM6600™ – supports HSPA+ data rates of up to 14.4 Mbps and CDMA2000® 1xEV-DO Rev. A/Rev. B
MDM8220™ – supports dual-carrier HSPA+ for data rates of up to 42 Mbps
MDM9600™ – supports LTE data rates of up to 100 Mbps with full backward compatibility to dual carrier HSPA+ and EV-DO Rev. A/Rev. B
MDM9200™ – supports LTE data rates of up to 100 Mbps with full backward compatibility to dual carrier HSPA+
No word is available on when they will start showing up. But will let you now soon.
Resources
Copper Wire: Copper Wire- We are the best Copper Wire Manufacturer & Exporter of PVC Copper Wire with Tinsel Copper Wire & Copper Wire gauge for Stranded Wire. Also find Bare Copper Strip, Jumper Wire, Braided Copper Wire & Strip and all types of Electrical Copper Wire.